Lead-free solder composition
US11738412B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 8, 2022 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 8, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12722
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.