Patent · US Active

Filler for vacuum brazing of TU1 oxygen-free copper and application thereof

US11738413B2 · kind B2 · utility

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5References

5Claims

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Assignee

Wuxi Unicomp Technology Co., Ltd. · CN

Inventors

Jun Liu · Dressendorf, DE
Liucheng WANG · Wuxi, CN
Xiaojun Qiu · Nanhu, CN
Wei Feng Zhang · Shanghai, CN

Key dates

Filing date	Jul 14, 2021
Grant date	Aug 29, 2023
Priority date	—
Expiry date	Jul 14, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.