Patent · US Active

Method for embossing a component

US11738500B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Mahle International GmbH · DE

Inventors

Klaus Hassdenteufel · Gerlingen, DE
Stefan Schill · Renningen, DE
Daniel Schleicher · Esslingen am Neckar, DE

Key dates

Filing date	Mar 17, 2020
Grant date	Aug 29, 2023
Priority date	—
Expiry date	Aug 1, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/18
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.