Shaping method and shaping device
US11738504B2 · kind B2 · utility
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4References
30Claims
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Key dates
| Filing date | Nov 22, 2019 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Aug 30, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An object shaping method includes a step of forming a powder layer using first powder, a step of placing second powder having an average particle diameter smaller than an average particle diameter of the first powder at a part of a region of the powder layer, and a first heating step of heating the powder layer in which the second powder is placed. The average particle diameter is equal to or larger than 1 nm and equal to or smaller than 500 nm, and the first heating step performs heating the powder layer at a temperature at which particles contained in the second powder are sintered or melted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.