Photosensitive resin composition
US11739215B2 · kind B2 · utility
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7Claims
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Assignee
Inventor
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Sep 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are photosensitive resin compositions capable of forming positive resin films with excellent heat shape retention. The photosensitive resin compositions comprises a polymer having a monomer unit represented by the following general formula (I) and a polyamideimide: where R1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.