Die assembly and methods of using same
US11739444B2 · kind B2 · utility
0Cited by
64References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 1, 2022 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Aug 1, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/05
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for forming filaments that utilizes a die assembly having a single uninterrupted open area and a fluid supplied by a fluid flow path within the die assembly that is divided into at least two different fluid cavities, one of the fluid cavities present between a nozzle plate comprising the plurality of filament forming nozzles and an air plate, and another fluid cavity of the at least two different fluid cavities present between the air plate and an enclosure plate that defines the single uninterrupted open area is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.