Floor board and method for manufacturing such floor boards
US11739539B2 · kind B2 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Oct 19, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A floor board including a decorative surface layer applied to a substrate, where the substrate has MDF or HDF material at a side edge thereof, where the side edge is treated both with an impregnation agent and/or a sealing agent based on a superabsorbing material. Also a method for manufacturing such floor boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.