Patent · US Active

Polish rod leveling assembly

US11739598B2 · kind B2 · utility

0Cited by
15References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 23, 2022
Grant dateAug 29, 2023
Priority date
Expiry dateMay 23, 2042

Classification

  • Technology area (CPC E)Fixed Constructions
  • CPC primaryE21B47/009
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A leveling assembly that is capable of lubrication without separating the individual leveling plates. The leveling assembly comprising: a first plate having a convex curved surface having a curvature, the first plate defining a central bore therethrough; a second plate having a concave curved surface shaped to mate with the convex curved surface; the second plate defining a central bore therethrough. One of the first or second plates defines a lubrication passageway extending from a first opening on an exterior surface thereof to a second opening on the curved surface, and a lubrication groove extending from the second opening to the central bore of the plate with the lubrication passageway.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.