Shape memory alloy filament crimping element
US11739737B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2019 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 6, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF03G7/06143
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for filament crimping. The apparatus includes a filament crimp element. The filament crimp element includes a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Interlock features configured for cold welding are also included. Methods for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.