Integral heat exchanger mounts
US11740036B2 · kind B2 · utility
0Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2022 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2280/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An embodiment of a heat exchanger assembly includes a first manifold adapted for receiving a first medium, a core adapted for receiving and placing a plurality of mediums, including the first medium, in at least one heat exchange relationship, and a core meeting the first manifold at a first core/manifold interface; The mounting structure supports a heat exchanger, and is metallurgically joined to at least one heat exchanger assembly component at a first joint integrally formed with the mounting structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.