Multi-sensing PTAT for multiple-location temperature sensing
US11740137B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2020 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 21, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D23/2034
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.