Multistory electronic device testing apparatus
US11740283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2022 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 7, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0458
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.