Etched facet coupling for flip-chip to photonics chip bonding
US11740407B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 22, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Oct 22, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are integrated photonics systems including a coupling strategy to couple light in and out of optoelectronic flip-chips bonded to a photonics chip. The refined tolerances for flip-chip assembly and angled facets defined on both chips at optical couplings improve optical performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.