Silicon photonics multi-channel parallel optical component and coupling method thereof
US11740417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/1215
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.