Apparatuses for reducing metal residue in edge bead region from metal-containing resists
US11740559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Apparatuses and methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.