Multilayer electronic component and board for mounting the same
US11742145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10636
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes: a body including a dielectric layer and internal electrodes and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode including a connection portion disposed on one of the third and fourth surfaces, an upper band portion extending from the connection portion onto a portion of the second surface, and a lower band portion extending onto a portion of the first surface. The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion, and the Pd plating layer is disposed to extend onto a portion of the connection portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.