Patent · US Active

Cleavable additives for use in a method of making a semiconductor substrate

US11742197B2 · kind B2 · utility

0Cited by

3References

8Claims

0Family size

Assignee

BASF SE

Inventors

Andreas Klipp · Lambsheim, DE
Christian Bittner · Bensheim, DE
Simon Braun · Mannheim, DE
Guenter Oetter · Bischofswerda, DE
Yeni Burk · Ludwigshafen, DE

Key dates

Filing date	Apr 2, 2019
Grant date	Aug 29, 2023
Priority date	—
Expiry date	Apr 18, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC07C271/12
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.