Multiple die package using an embedded bridge connecting dies

US11742293B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Yidnekachew S. Mekonnen · Chandler, US
• Kemel Aygun · Chandler, US
• Ravindranath V. Mahajan · Chandler, US
• Christopher S. Baldwin · Royal Oak, US
• Rajasekaran Swaminathan · Chandler, US

Key dates

• Filing date: Mar 22, 2017
• Grant date: Aug 29, 2023
• Expiry date: Apr 6, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15313
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.