Component assemblies and embedding for high density electronics

US11744018B2 · kind B2 · utility

Assignee

• KEMET Electronics Corporation · US

Inventors

• John Bultitude · Greenville, US
• Peter Blais · Simpsonville, US
• James A. Burk · Simpsonville, US
• Galen W. Miller · Simpsonville, US
• Hunter Hayes · Simpsonville, US
• Allen Templeton · Simpsonville, US
• Lonnie G. Jones · Greenville, US
• Mark R. Laps · Simpsonville, US

Key dates

• Filing date: Jan 13, 2021
• Grant date: Aug 29, 2023
• Expiry date: Aug 28, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/8503
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.