Mechanically bridged SMD interconnects for electronic devices
US11744020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.