Sinterable films and pastes and methods for use thereof
US11745294B2 · kind B2 · utility
1Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2017 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Jan 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.