Automated lamination system and method for embedding printed electronic elements in a composite structure
US11745440B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2020 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Mar 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1208
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.