Heat-expandable microspheres and applications thereof
US11746204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Feb 17, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2333/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-expandable microspheres having a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a copolymer produced from a polymerizable component containing 15 to 90 wt % of acrylonitrile, 3 to 50 wt % of an acrylate ester monomer (A) represented by formula (1) shown below, and 3 to 70 wt % of a methacrylate ester monomer (B) represented by formula (2) shown below. The weight ratio of the acrylate ester monomer (A) represented by formula (1) to the methacrylate ester monomer (B) represented by formula (2) in the polymerizable component (A:B) ranges from 10:90 to 90:10: H2C═CH—COOR1 (1)H2C═C(CH3)—COOR2 (2). Also disclosed are hollow particles manufactured by expanding the heat-expandable microspheres; a composition containing a base compound and the heat-expandable microspheres or the hollow particles; and a formed product manufactured by molding or applying the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.