Probe substrate and electrical connecting apparatus
US11747365B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 18, 2019 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.