Integrated circuit device, semiconductor substrate, and test system including the integrated circuit device
US11747393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2022 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Mar 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0655
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device, a semiconductor substrate, and a test system including the integrated circuit device are disclosed. The integrated circuit device includes a power terminal configured to receive a source voltage, a power via connected to the power terminal and passing through at least one of a number of layers, a number of inductive vias arranged apart from the power via and passing through at least one of the number of layers, a number of wirings connected to ends of at least some of the number of inductive vias and configured to form a coil wound in toroidal form together with the number of inductive vias, around the power via, and a test terminal configured to output an induced voltage in the coil externally of the integrated circuit device, in response to the supply of the source voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.