Carrier based laser assembly and method of assembly thereof with photonic integrated circuit
US11747554B2 · kind B2 · utility
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1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | May 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/04257
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.