Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11749302B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2022 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | May 12, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.