Polishing method, and polishing composition and method for producing the same
US11749531B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Jul 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.