Maskless etching of electronic substrates via precision dispense process
US11749539B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2020 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Dec 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4803
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.