Wafer processing apparatus
US11749557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Feb 24, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/0211
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.