Patent · US Active

Arrangement for electronic components

US11749580B2 · kind B2 · utility

1Cited by

4References

18Claims

0Family size

Assignee

AUDI AG · DE

Inventor

Daniel RUPPERT · Lenting, DE

Key dates

Filing date	Oct 16, 2020
Grant date	Sep 5, 2023
Priority date	—
Expiry date	May 4, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L25/18
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An arrangement which has at least one semiconductor module made of silicon carbide, a driver circuit for the at least one semiconductor module, and a cooling system, wherein the at least one semiconductor module and the driver circuit are arranged adjacent to one another, wherein the driver circuit is connected to the cooling system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.