Wiring substrate
US11749596B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Feb 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a conductor pad, an insulating layer formed on the conductor pad such that the insulating layer is covering the conductor pad and has a through hole, a bump formed on the conductor pad such that the bump is formed in the through hole penetrating through the insulating layer. The conductor pad is formed such that the conductor pad has a connecting surface connected to the bump, a concave part formed on the connecting surface of the conductor pad to the bump, and a convex part formed in the concave part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.