Patent · US Active

Embedded bridge substrate having an integral device

US11749606B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Amit Jain · Marlboro, US
Sameer Shekhar · Portland, US
Chin Lee Kuan · Bentong, MY
Kevin J. Doran · North Plains, US
Dong-Ho Han · Beaverton, US

Key dates

Filing date	Jul 9, 2021
Grant date	Sep 5, 2023
Priority date	—
Expiry date	Jul 9, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15192
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.