Semiconductor device structure with magnetic element
US11749711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2022 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Feb 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.