Inverter device including a bootstrap circuit
US11750112B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2022 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Dec 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To achieve high density integration of components while securing an insulation distance between a bootstrap capacitor and an intelligent power module. In a printed wiring board, a region where a capacitor is mounted is located in a region where an intelligent power module is mounted. Therefore, the capacitor mounted on the printed wiring board is placed between the printed wiring board and the intelligent power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.