Overlap joint flex circuit board mating
US11751333B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Sep 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.