Heat dissipation for head-mountable device
US11751366B1 · kind B1 · utility
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4References
19Claims
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Key dates
| Filing date | Apr 12, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0178
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A head-mountable device can provide passive cooling that utilizes surfaces of an optical assembly to allow heat to be managed in a manner that does not detrimentally impact the visual information displayed to the user. Lenses can be coated with a transparent and thermally conductive material, such as silver nanowire. Such a thermal layer can provide superior thermal conductivity, transmittance, flexibility, flat transmission, low cost, and angular color stability. The thermal layer can passively manage heat by increasing the surface area across which heat can be efficiently dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.