Laser apparatus and substrate etching method using the same
US11752577B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Nov 11, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Mar 14, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/283
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser apparatus may include a laser generator generating at least one a laser beam, which is used as an input light, an optical system converting the input light, which is provided from the laser generator, into a plurality of pattern lights, and a stage, on which a target object is loaded. The output light may be irradiated onto the target object. The optical system may divide the input light into a plurality of divided lights, and the pattern lights may be produced by constructive interference of the plurality of divided lights. A diameter of each of the pattern lights may be smaller than a diameter of the input light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.