Multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform
US11752581B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Apr 1, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.