Electrical or electronic assembly and method for producing an electrical or electronic component
US11752674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/34
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method is provided for the production of an electrical or electronic component having a conductor element with two contact points and a plastic structure injection-molded thereon. A strip-type metal substrate, having multiple conductor element blanks and a carrier structure, is provided. Grooved depressions are produced on all peripheral surfaces of the blanks on a texturing section with one or two laser light sources. With a single laser light source the grooved depressions are produced on at least two primary peripheral surfaces which adjoin one another and form a common edge such that a multiplicity of the grooved depressions extends without interruption continuously into the primary peripheral surfaces. A conductor element blank is separated from the carrier structure. The resulting conductor element is encapsulated with plastic by injection molding on all peripheral surfaces within a section to be encapsulated. The plastic structure thereby formed extends into the grooved depressions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.