Patent · US Active

Method for producing an adhesive bond and support plate for producing an adhesive bond

US11752701B2 · kind B2 · utility

0Cited by

1References

23Claims

0Family size

Assignee

ASMPT AMICRA GmbH · DE

Inventors

Rudolf Kaiser · Lappersdorf, DE
Horst Lapsien · Regensburg, DE

Key dates

Filing date	Jul 29, 2020
Grant date	Sep 12, 2023
Priority date	—
Expiry date	Jul 29, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB32B2315/08
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.