Patent · US Active

Heat-sensitive recording material

US11752793B2 · kind B2 · utility

0Cited by

1References

29Claims

0Family size

Assignee

MITSUBISHI HITEC PAPER EUROPE GMBH · DE

Inventors

Nadia El-Karzazi · Bielefeld, DE
Claas Boxhammer · Herford, DE

Key dates

Filing date	Jan 31, 2019
Grant date	Sep 12, 2023
Priority date	—
Expiry date	Apr 7, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41M2205/40
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A heat-sensitive recording material including a substrate, a heat-sensitive recording layer which includes N-(4-methylphenylsulfonyl)-/V-(3-(4-methylphenylsulfonyloxy)pheny-purea and/or N42-(3-phenylureido)phenyl]benzol sulfonamide, and an intermediate layer which is arranged between the substrate and the heat-sensitive recording layer and which includes calcined aluminum silicate, and a method for producing a heat-sensitive recording material and to the use of calcined aluminum silicate in an intermediate layer of a heat-sensitive recording material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.