Overmolded diaphragm for use in a pump
US11754181B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2023 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Jan 6, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B53/16
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A diaphragm for use in a pump includes a cover configured to contact fluid to pump the fluid and a backing disposed at least partially within the cover. The backing includes a flexible plate that extends outward relative to a core of the backing, the flexible plate configured to flex during reciprocation of the diaphragm. The cover is formed from a first polymer and the flexible plate is formed from a second polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.