Baffles for thermal transfer devices
US11754318B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Nov 1, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2009/226
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A baffle for a thermal transfer device can include a body having a multiple first apertures that traverse therethrough, where each first aperture has a first outer perimeter that includes a first base shape and at least one first protrusion extending from the first base shape. Each of the first apertures is configured to receive a tube. The first base shape of each first aperture has a first shape and a first size that is configured to be substantially the same as the first shape and the first size of an end of a tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.