Patent · US Active

Thermal dissipation in dual-chassis devices

US11755080B2 · kind B2 · utility

0Cited by

2References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Prakash Kurma Raju · Bengaluru, IN
Babu Triplicane Gopikrishnan · Kanchinakote, IN
Bijendra Singh · Bengaluru, IN
Prasanna Pichumani · Kanchinakote, IN
Raghavendra Doddi · Bengaluru, IN
Harish Jagadish · Kanchinakote, IN
Gopinath Kandasamy · Bengaluru, IN
David Pidwerbecki · Corvallis, US

Key dates

Filing date	Dec 23, 2021
Grant date	Sep 12, 2023
Priority date	—
Expiry date	Dec 23, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH04M2250/16
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.