Sensor device and method for manufacturing a sensor device
US11756712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Oct 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/283
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an embodiment a sensor device includes a sensor chip having a plurality of printed ceramic layers and unprinted ceramic layers, at least one termination layer configured to make electrical contact with an electrically conductive material, wherein the termination layer is formed at least on a top side and/or on a bottom side of the sensor chip, wherein the printed ceramic layers are at least partially printed with an electrically conductive material, and wherein an electrical resistance of the sensor chip is determined by an overlap area of the electrically conductive material or by a distance of the electrically conductive material from the termination layer and at least one damping layer directly located at at least a partial area of an outer surface of the sensor chip, wherein the damping layer includes a material which has a greater elasticity than a material of the termination layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.