Pick and place machine cleaning system and method
US11756811B2 · kind B2 · utility
0Cited by
99References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Jul 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.