Power module including lead frame unit connecting first substrate and second substrate
US11756867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Sep 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/33181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.