Wedge tool, bonding device, and bonding inspection method
US11756919B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Jun 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/859
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is an object to enable a non-destructive inspection of reliability of a bonding part and enabling an accurate inspection. A wedge tool includes: a groove which is formed along a direction of an ultrasonic vibration in a tip portion and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.