System and method for interoperability in remote provisioning architectures for embedded universal integrated circuit cards
US11758385B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | May 6, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Nov 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W12/72
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A system is provided that allows profiles from multiple mobile network operators to be provisioned across multiple eUICCs from different eUICC manufacturers that may each utilize different provisioning methods. This is accomplished through the use of an abstraction layer with application programming interfaces (APIs) that enable SM-DP and SM-SR functionality for eUICCs from multiple eUICC manufacturers and for multiple MNO profiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.